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High Signal Transmission Taconic High Frequency HF PCB Circuit Boards

Shenzhen Xinchenger Electronic Co.,Ltd
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High Signal Transmission Taconic High Frequency HF PCB Circuit Boards

Brand Name : XCE

Model Number : XCET

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Taconic

Layer : 2

Color : black

Min line space : 10mil

Min line width : 10mil

Copper thickness : 1OZ

Size : 9*7cm

Board THK : 1.0MM

Panel : 1*1

Surface finish : Immersion silver

Model : XCET

Brand : XCE

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High Signal Transmission Taconic High Frequency PCB Circuit Boards

Technology Sheet

Capabilities Standard Production Advanced Production
Layer Count / Technology 4 - 28 Layers 4 - 28 Layers
PCB Thickness Range 0.5 - 2.4 mm 0.32 - 2.4 mm
Build Up Core & Hybrid Build Up Core & Hybrid Build Up
Materials FR4 / Rogers / Taconic / others (Teflon based)

FR4 / Taconic / Rogers /

others on request

Glass Transition Temperature 105℃ / 140℃/ 170℃ 105℃/ 140℃/ 170℃
Standard Glass Cloth 106 / 1080 / 2116 / 1501 / 7628

1037 / 106 / 1080 / 2116 /

1501 /

7628

Copper Thickness 18μm / 35μm / 70μm

9μm / 18μm / 35μm /

70μm

Copper Plating Holes 20μm (25μm) 13μm / 20μm/ 25μm
Min. Line / Spacing 100μm / 100μm 50μm / 50μm
Soldermask Registration ‘+/- 65μm(Photoimageable)

’+/- 25μm

(Photoimageable)

Min. Soldermask Dam 75μm 60μm
Soldermask Color Green / white / black / red / blue

Green / white / black

/ red / blue

Max. PCB Size 575 mm x 500 mm 575 mm x 500 mm
Production Panel 609.6 mm x 530 mm 609.6 mm x 530 mm
609.6 mm x 457.2 mm 609.6 mm x 457.2 mm
Min. Annular Ring 150μm 100μm
Smallest Drill 0.28 mm 0.15 mm
Smallest Routing Bit 0.8 mm 0.8 mm
Surfaces OSP / HAL Lead Free / Immersion Tin

OSP / HAL Lead Free /

Immersion Tin

Immersion Ni/Au Immersion Ni/Au
Plated Ni/Au Plated Ni/Au
Immersion Ag Immersion Ag
Scoring Yes Yes
ID Print White White
Blue Mask & Carbon Print Yes Yes

Introduction:

The increasing complexity of electronic components and switches continually requires faster

signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times

in electronic components, it has also become necessary for high frequency (HF) technology to

view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that the

impedance (dynamic resistance) varies with respect to the sending component. To prevent such

capacitive effects, all parameters must be exactly specified, and implemented with the highest level

of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace

geometry,the layer buildup, and the dielectric constant (er) of the materials used.


Product Tags:

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